Wafer Handlermechatronic Packing Tool

Wafer Handlermechatronic Packing Tool

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  ?????? mPT(mechatronic Packing Tool)???? ??? ??? ??? ???? ??? ?? ?(Warped) ???? ???? ???? ??? ?????. ?? ??? ?? ??? ???? ?????? ?? ???, FOUP, FOSB? ??? ??? ??? ???? Shipping Box ?? ??? ???? ?????. ??? ?? ??? ??? ???? ??? ??? ?? ??? ? ????.

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Packing/Unpacking

  • mPT 150/200 ? ? ??? ?????? ???? 150/200 mm (6”/8″) ???? ??/???? ? ? ??? ???????.
  • mPT 200/300f ? ?? ?????? ???? 200/300 mm (8″/12″) ???? ???? ??/???? ? ? ??? ???????.
  • mPT 200/300 ? ????(Bernoulli)?????? ???? 200/300 mm (8″/12”) ???? ??/???? ? ? ??? ???????.

 

  • mPT 200/300 neo ? ????(Bernoulli)?????? ???? 200/300 mm (8″/12”) ???? ??/???? ? ? ??? ???????.

 

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mPT 150/200:

  • Wafer sizes: 150 mm (6”) and 200 mm (8”)
  • handling of standard, thin, warped, eWLB, wafer with support ring and MEMS wafers
  • highest level of reliability and availability
  • optimized footprint
  • 5 stations for shipping boxes and packing material
  • automatic End Effector changing station
  • two cassette stations
  • mapping sensor
  • pre-aligner for 6″ and 8″
  • SECS/GEM interface
  • CE certificated
  • SEMI standard compliant

mPT 200/300f:

  • Wafer size: 200mm (8″) and 300 mm (12”) on frame
  • handling of wafers on frame
  • highest level of reliability and availability
  • two 6 axle robots for optimized footprint
  • up to 8 stations for shipping boxes and packing material
  • automatic End Effector changing station
  • two stations for frame cassettes
  • SECS/GEM interface
  • CE certificated
  • SEMI standard compliant

mPT 200/300:

  • Wafer size: 200mm (8″) and 300 mm (12”)
  • handling of standard, thin, warped, eWLB, wafer with support ring and MEMS wafers
  • highest level of reliability and availability
  • two 6 axle robots for optimized footprint
  • up to 8 stations for shipping boxes and packing material
  • automatic End Effector changing station
  • two load-ports
  • mapping sensor
  • pre-aligner for 8″ and 12″
  • SECS/GEM interface
  • CE certificated
  • SEMI standard compliant

mPT 200/300 neo:

  • Wafer size: 200mm (8″) and 300 mm (12”)
  • handling of standard, thin, warped, eWLB, wafer with support ring and MEMS wafers
  • optimized foodprint
  • high troughput
  • highest level of reliability and availability
  • dual arm 3 axis robot
  • station for shipping boxes
  • two stations for packing material
  • one station for recycling material
  • GUI/Operator interface with touchscreen
  • two load-ports
  • pre-aligner for 8″ and 12″
  • CE certificated
  • SEMI standard compliant

Configuration Options:

  • third station for packing material
  • Sorting function w. FOSBs
  • OCR / QR / DMC reader for wafer ID
  • Bar Code Reader for shipping box ID
  • RFID antennas for cassette / FOUP ID
  • Various End Effectors with automatic End Effector change station
  • SECS/GEM interface
  • FFU (filter fan unit) for higher cleanroom class
  • Ionizer with temperature and humidity monitoring
  • Keyboard, manual Lot ID Reader
  • additional load / unload position for external metrology
 

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